Intern, Process Engineering (Advanced Packaging)

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job's mission Join ASM’s Advanced Packaging R&D team and help shape the future of semiconductor technology. This internship focuses on developing advanced surface preparation solutions that enable high-quality hybrid bonding, a critical technology that allows chips to communicate at extremely high speeds with minimal power loss. Working alongside experienced researchers and engineers, you will contribute to cutting-edge innovation that supports the next generation of semiconductor devices. What you will be working on • Develop advanced surface preparation solutions for hybrid bonding interconnect applications. • Define process specifications and requirements to achieve targets for bonding strength, defectivity, uniformity, and overall process performance. • Perform process validation activities and help establish best-known methods (BKMs) for process integration. • Design, execute, and analyze experiments to evaluate process performance and identify opportunities for improvement. • Collaborate closely with ASM’s Advanced Packaging R&D team on leading-edge technology development. • Present findings and recommendations based on experimental results and data analysis. What Success Looks Like in This Internship • Build a strong understanding of hybrid bonding principles and become proficient in operating process and metrology equipment independently. • Design and execute basic experiments, analyze data, and draw meaningful conclusions. • Deliver one or more process solutions, best-known methods, or integration concepts that support technology development. • Contribute to the successful startup and advancement of hybrid bonding processes for future customer engagements What we are looking for • Currently pursuing a Bachelor's, Master's, or equivalent degree in Electronics Engineering, Materials Science, Mechanical Engineering, Systems Engineering, or a related field. • Strong interest in semiconductor manufacturing processes and advanced packaging technologies • Ability to analyze technical data and communicate findings clearly. • Effective teamwork and problem-solving skills What sets you apart • Knowledge of semiconductor process technologies. • Experience with material surface characterization techniques. • Strong data analysis and interpretation skills. • Curiosity, initiative, and a passion for innovation in semiconductor technology. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect. To learn more about ASM, find us at asm.com and on LinkedIn , Facebook , Instagram, X and YouTube . ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.