Associate Engineer (Sputter / Photolithography / Descum)

Responsibilities; • Line sustaining for dry process (i.e. Sputter, Photolithography and Descum) • Support lot dispositions and OCAP executions • Involve in Continuous Improvement Projects • Working with QM Dept. to response customer inquires and issues • Execute CIP or project handling that contributes yield & cost efficiency improvement • Ensure SPC is maintain and in control • Support new material evaluation and new tool set up Requirements; • Diploma in electronics or related disciplines • Preferably with minimum 2 years' experience in Wafer bumping process running high volume • Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)