Associate Engineer, Equipment

Position Summary The Equipment Associate Engineer (DP/Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment. Responsibilities: • Perform equipment Line Sustaining function (corrective maintenance),preventive maintenance, predictive maintenance, and calibration. • Sustain and improve overall equipment performance (OEE). • Update consumables/spare parts to ensure no delay in machine recovery due to no spare. • Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement. • Assist Engineers in setting up new machine and buy-off. • Maintain good housekeeping and safety practices in the cleanroom. • Communicate with supervisors, fellow shift personnel and vendors to resolve problems. • Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents. • Comply safety standards and procedures during shift duty or working in the production line. • Responsible for maintenance and repairs on the assigned equipment. • Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. • Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification. • Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction. • Any other ad-hoc duties as assigned. Requirements: • Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent. • Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. • Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. • Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection). • Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.