Senior RF Engineer

Applied Angstrom Technology Pte. Ltd. (“AAT”) is a start-up semiconductor equipment company with our headquarters in Singapore. AAT has the mission to be the world-class process technology provider in the Angstrom era for 3D device manufacturing and to build an ecosystem in equipment design, manufacturing, and component/material supply chain in the US and Singapore. As a Senior RF Engineer at AAT, you will operate at the critical intersection of high-frequency power electronics and advanced plasma physics. You will serve as the technical authority for AAT’s RF delivery architecture, driving clean-sheet design, dynamic impedance matching, and plasma source characterization to enable sub-angstrom profile precision in next-generation Atomic Layer Etching (ALE) chambers. The ideal candidate shall be able to perform the following:  • Support RF & Plasma tool development/qualification and implementation in Plasma Etch chambers for R&D and Production applications • Conduct experiments and characterizations of RF & Plasma systems and components at bench and tool levels using various instruments including Network Analyzers, Spectrum Analyzer, Plasma Probes, analog and digital data acquisition controllers. • Develop new methods to distribute RF through antennas and networks to ignite stable plasmas using different frequency and Generators. • Develop new RF & Plasma arc detection and diagnostic methods to be used in R&D and Production applications. • Work with Process Engineers and Field/Customer support teams to provide RF & Plasma support to quickly troubleshoot and resolve field/customer issues. Job Qualifications:  • Masters or PhD in science or engineering areas with emphasis on high frequency electronics or plasma physics • Experience with a wide range of plasmas (DC~MW, various pressure and gas conditions) • Knowledge of unique challenges in large area plasma production and the techniques used in the industry. • Knowledge in plasma diagnostics (Langmuir probes, optical diagnostic, microwave diagnostic etc.) • Knowledge in Etch or CVD technology, applications, and film metrology • Experience in mechanical design (manufacturability, mechatronics, material properties, vacuum systems, gas flow etc.) • Experience with system design and module integration on system level (PLCs, IoT, Edge, safety) • Solid background in RF power delivery, impedance matching, RF sensors, transmission line theory, electronic circuits, amplifiers, sensors etc.