Senior Advanced Packaging Engineer [ Semiconductor | Thermo Compression Bonding (TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip ] - 8890

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development • Location: Admirax St • Working Days: 5 Day A Week • Working hours : 9:00am - 6:00pm • Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering • Understand customer packaging roadmaps and manufacturing requirements. • Translate process requirements into equipment specifications. • Participate in customer technical discussions and application reviews. • Support technical sales activities and customer demonstrations. • Gather customer feedback and recommend future product enhancements. Advanced Packaging Process Development - Develop and support applications involving: • Thermo Compression Bonding (TCB) • Flip Chip Assembly • Hybrid Bonding • HBM Packaging • CoWoS • CoPoS • 2.5D Packaging • 3D Packaging • Chiplet Integration • Large Die Packaging - Evaluate and optimize: • Bond force • Temperature profiles • Process windows • Alignment accuracy • Package warpage • Yield • Reliability Equipment Development - Work closely with multidisciplinary engineering teams to define: • Machine architecture • Functional specifications • Accuracy requirements • Throughput targets • Thermal performance • Bonding process capability • Reliability requirements • Customer acceptance criteria - Provide technical guidance throughout equipment development. Machine Qualification - Serve as the internal customer during equipment development. - Responsibilities include: • Defining machine acceptance criteria • Process qualification • FAT and SAT support • Customer buyoff support • Qualification reporting • Continuous performance improvement Technology & Market Intelligence - Monitor industry developments in: • Advanced packaging technologies • Semiconductor manufacturing trends • Customer requirements • Competitor equipment • Emerging packaging architectures - Support future product strategy and technology roadmap planning. Requirements: - Bachelor's or Master's Degree in: • Materials Engineering • Mechanical Engineering • Electrical Engineering • Chemical Engineering • Physics • Semiconductor Engineering • Related Engineering disciplines - Minimum 5 years experience in semiconductor advanced packaging. - Hands-on experience in one or more of the following: • Thermo Compression Bonding (TCB) • Advanced Packaging Process Development • Flip Chip Assembly • New Product Introduction (NPI) • Process Qualification • Equipment Qualification • Manufacturing Engineering • Customer Process Development - Experience supporting advanced package technologies such as: • HBM • CoWoS • CoPoS • Chiplets • 2.5D Packaging • 3D Packaging • Large Die Packaging - Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage. - Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply. - Strong understanding of: • Thermo Compression Bonding (TCB) • Semiconductor Packaging • Flip Chip Assembly • Process Qualification • SPC • DOE • Yield Improvement • Reliability Testing • Failure Analysis • Package Warpage • Thermal Management • Alignment Accuracy • Semiconductor Manufacturing Processes - Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded. Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia) OR Email to : supreme.lydiachieng@gmail.com The Supreme HR Advisory Pte Ltd Reg No: R1988890 EA No: 14C7279