[0580] Senior / Mechanical Design Engineer - TCB / Flip-chip / Die-bonding | North/ 5 days/ $9k

Location: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 6,000 – SGD 9,000/month (Based on experience and technical capability) Responsibilities: • Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment. • Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation. • Design equipment modules such as: • - Wafer handling systems • - Substrate, strip, panel, or glass-panel handling systems • - Die ejection, die pickup, and die transfer mechanisms • - Precision XY, XYZ, XYZT, and multi-axis positioning stages • - Bondheads and thermal bondheads • - Micro-Z, force-control, compliance, and tip-tilt mechanisms • - Heating, cooling, vacuum, gas, and thermal isolation structures • - Conversion kits, change parts, fixtures, tooling, nests, and bond tools • Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures. • Conduct tolerance stack-up and design reviews for critical precision assemblies. • Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design. • Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams. • Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification. • Investigate machine problems and implement practical design improvements. • Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost. • Maintain proper engineering documentation and design-change records. Requirements: • Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline. • Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries. • Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent. • Able to prepare detailed manufacturing and assembly drawings. • Good understanding of: • - Fits and tolerances • - GD&T • - Bearings and linear-motion components • - Machining and fabrication processes • - Material selection and surface treatment • - Mechanical assembly and alignment • Able to develop practical mechanism concepts rather than only produce drawings from instructions. • Willing to support machine assembly, debugging, testing, and continuous improvement. • Experience in semiconductor packaging or semiconductor automation equipment. • Experience designing precision, high-stiffness, or thermally stable machine modules. • Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity. • Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment. • Experience with tolerance analysis, FEA, thermal simulation, or structural analysis. • Experience taking a module from concept through assembly, testing, and customer acceptance. • Familiarity with DFM, DFA, cost reduction, and engineering change control. • Experience with prototype, customised, or first-of-a-kind equipment development. The Supreme HR Advisory Pte. Ltd || 14C7279 Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580