TCB Product Manager

TCB Product Manager Job Summary: We are seeking an experienced TCB (Thermal CompressionBonding) professional to lead the development of new TCB products whilemanaging a team of TCB Engineers and TCB Process Engineers. This role is bothhands-on and leadership-oriented: you will drive product and processdevelopment from concept to mass production, and you will build, mentor, andmanage a high-performing engineering team. Key Responsibilities: A. New TCB Product & Process Development • Lead the development of new TCB products, including process evaluation, process flow formulation, and module functional verification to ensure Design for Manufacturability (DFM). • Drive the development and debugging of TCB process parameters (temperature, pressure, time, heating/cooling rates, etc.) and resolve critical process bottlenecks such as warpage control, coplanarity, and void rate. • Evaluate and qualify new TCB materials, equipment, and consumables in collaboration with R&D, Quality, and Production teams. • Lead NPI (New Product Introduction) projects, ensuring smooth transition from pilot run to mass production. • Promote CIP (Continuous Improvement Plan) for major equipment and product abnormalities; lead Failure Analysis (FA) and issue improvement reports. • Monitor process stability (Cpk/Ppk) and product yield; use data-driven methods to adjust processes and drive yield improvement. • Develop and refine technical documentation, including PFD, SOP, OCAP, EFMEA, and inspection standards. B. Team Management & Leadership • Manage, mentor, and develop a team of TCB Engineers and TCB Process Engineers. • Assign tasks, set priorities, and ensure project milestones are met on time and within budget. • Conduct regular performance reviews, provide technical guidance, and support career development for team members. • Foster a culture of collaboration, accountability, and continuous improvement. • Coordinate team resources across multiple projects and ensure effective knowledge transfer and documentation. • Interface with cross-functional teams (R&D, Quality, Production, Equipment) to align engineering resources with business objectives. Qualifications: Education: • Bachelor’s degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields. • Master’s degree or above preferred. Work Experience: • Minimum of 5–8 years of experience in TCB-related equipment and process development in semiconductor packaging, with at least 2 years in a team lead or supervisory role. • Prior experience in 2.5D/3D advanced packaging and HBM stacking is highly preferred. • Familiar with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes. Professional Skills: • Proficient in operation, process debugging, and troubleshooting of mainstream TCB/FC equipment (e.g., ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi, etc.). • Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction process, or Underfill process is highly preferred. • Strong data analysis skills; proficient in JMP, Minitab, DOE, and yield analysis. • Strong quality awareness and hands-on capabilities; able to work under pressure and handle overtime when necessary. • Excellent communication, coordination, and teamwork skills. • Proven ability to lead, motivate, and develop technical teams. Preferred / Nice-to-Have: • Experience with advanced packaging technologies such as CoWoS, SoIC, or chiplet integration. • Familiarity with customer-facing technical reviews and product qualification cycles. • Experience in setting up new TCB process lines or transferring processes from R&D to production. Working Conditions: • May require occasional overtime and travel to support production or customer requirements. • Work primarily in engineering labs, cleanroom, and office environments.