Process Engineer – Flip Chip Bonding Process

Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment. Key Responsibilities: Process Engineering & Manufacturing Support • Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting. • Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets. • Monitor and analyse process data to identify trends, risks, and improvement opportunities. • Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues. • Drive permanent corrective and preventive actions to resolve chronic process and quality issues. • Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release. • Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution. • Documentation, Compliance & Audit Support • Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents. • Prepare production lines and process documentation for internal and external audits. • Support audit follow-up actions and ensure timely closure of findings. • Promote compliance with safety, quality, and manufacturing standards. • Continuous Improvement • Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness. • Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable. • Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence. • Qualifications: • Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline. • Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing. • Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered. Required Skills & Competencies: • Strong data analysis, problem-solving, and critical thinking skills. • Good communication and collaboration skills, with the ability to work effectively with cross-functional teams. • Good planning, organization, and follow-up skills. • Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals. • Proficiency in Microsoft PowerPoint, Excel, and Word. • Knowledge of statistical and quality tools such as SPC and MSA is preferred. Ideal Candidate Profile: • A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.