Engineer - Test Process (WLCSP)

Responsibilities • Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output. • Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization. • Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times. • Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects. • Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs). • Generate technical reports and preserve accurate engineering data for audit readiness. • Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls. • Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction. • Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping. Requirements • Bachelor's Degree in Engineering or a related technical discipline. • 3+ years of experience within a semiconductor manufacturing environment. • Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery. • Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.