Application / Process Engineer - Die Bond Tools

Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product portfolio includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package (PoP) Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders, among others. We are committed to driving innovation in semiconductor backend processes to support emerging packaging architectures and heterogeneous integration. Position Overview: Capcon is seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands-on support to both internal teams and customers. This position requires a strong technical background, a proactive mindset, and a passion for driving technology adoption and continuous improvement in high-precision semiconductor equipment. Key Responsibilities: • Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes. • Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance . • Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability. • Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield. • Develop test procedures, application recipes , and documentation for process qualification and validation; maintain detailed logs and technical reports. • Collaborate with R&D, software, mechanical, electrical, quality , and manufacturing teams to address technical challenges and implement design or process improvements. • Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities. • Serve as a key interface between customers and the R&D team , delivering user feedback to guide tool enhancements and feature development. Qualifications: • Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field). • 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred. • Strong knowledge of advanced packaging technologies , such as Flip-Chip, PoP, wafer-level, or panel-level bonding. • Experience with semiconductor equipment integration , motion control systems, and process development. • Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment. • Excellent communication and interpersonal skills; ability to work independently and in cross-functional teams. • Willingness to travel for customer support and on-site installations (as required).