6723 - Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability). Responsibilities: Customer Application Engineering • Understand customer packaging roadmaps and manufacturing requirements. • Translate process requirements into equipment specifications. • Participate in customer technical discussions and application reviews. • Support technical sales activities and customer demonstrations. • Gather customer feedback and recommend future product enhancements. Advanced Packaging Process Development -Develop and support applications involving: • Thermo Compression Bonding (TCB) • Flip Chip Assembly • Hybrid Bonding • HBM Packaging • CoWoS • CoPoS • 2.5D Packaging • 3D Packaging • Chiplet Integration • Large Die Packaging -Evaluate and optimize: • Bond force • Temperature profiles • Process windows • Alignment accuracy • Package warpage • Yield • Reliability Equipment Development -Work closely with multidisciplinary engineering teams to define: • Machine architecture • Functional specifications • Accuracy requirements • Throughput targets • Thermal performance • Bonding process capability • Reliability requirements • Customer acceptance criteria Provide technical guidance throughout equipment development. Machine Qualification Serve as the internal customer during equipment development. Responsibilities include: • Defining machine acceptance criteria • Process qualification • FAT and SAT support • Customer buyoff support • Qualification reporting • Continuous performance improvement Technology & Market Intelligence Monitor industry developments in: • Advanced packaging technologies • Semiconductor manufacturing trends • Customer requirements • Competitor equipment • Emerging packaging architectures Support future product strategy and technology roadmap planning. Requirements: - Bachelor's or Master's Degree in: • Materials Engineering • Mechanical Engineering • Electrical Engineering • Chemical Engineering • Physics • Semiconductor Engineering • Related Engineering disciplines -Minimum 5 years experience in semiconductor advanced packaging. -Hands-on experience in one or more of the following: • Thermo Compression Bonding (TCB) • Advanced Packaging Process Development • Flip Chip Assembly • New Product Introduction (NPI) • Process Qualification • Equipment Qualification • Manufacturing Engineering • Customer Process Development - Experience supporting advanced package technologies such as: • HBM • CoWoS • CoPoS • Chiplets • 2.5D Packaging • 3D Packaging • Large Die Packaging - Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage. - Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply. - Strong understanding of: • Thermo Compression Bonding (TCB) • Semiconductor Packaging • Flip Chip Assembly • Process Qualification • SPC • DOE • Yield Improvement • Reliability Testing • Failure Analysis • Package Warpage • Thermal Management • Alignment Accuracy • Semiconductor Manufacturing Processes - Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded. • 📲Interested candidates, please WhatsApp your resume to: +65 9642 0989 (Han) 📧 Or email your resume to: supreme.cc.han@gmail.com 👤Chaw Chiaw Han | R22106723🏢 The Supreme HR Advisory Pte Ltd | EA 14C7279