Mold and Symbol Trim Form (EOL) Equipment Engineer (MES Project)

Change the world. Love your job. Join TI as a specialized Equipment Engineer to drive the digital transformation of our to drive the digital transformation of our End-of-Line (EOL) manufacturing, specifically covering Mold and Symbol Trim Form (STF) operations. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment. Key Responsibilities: • MES Implementation (Project Phase): Represent EOL Equipment Engineering in the MES rollout. Define equipment workflows, setup/recipe controls, qualification requirements, equipment states, and interlocks for both Mold and STF machines. • Digital Integration: Translate physical shop-floor requirements (e.g., Mold cure/pressure/temp and STF mechanical/trimming parameters) into digital process designs and data collection needs. • Validation: Validate equipment integration scenarios and support User Acceptance Testing (UAT) and deployment for both process areas. • Sustaining (Post-Project Phase): Transition to production to manage equipment reliability, troubleshoot MES-related equipment issues, and drive continuous improvement in automation and uptime. Minimum Requirements: • Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree • Strong hands-on semiconductor equipment experience in with Mold equipment (e.g., Towa, ASM) AND/OR Symbol Trim Form equipment (e.g., ASM, Besi) with minimum 2 years of relevant experience Preferred Qualifications: • Experience with tool monitoring/interdiction software and SPC techniques. • Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early • Experience on tool monitoring and interdiction software, and equipment maintenance and documentation • Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors. • Strong verbal and written communication skills • Demonstrated strong analytical, critical thinking and problem solving skills • Ability to work in teams and collaborate effectively with people in different functions • Ability to take the initiative and drive for results • Strong time management skills that enable on-time project delivery • Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment • Demonstrated ability to build strong, influential relationship