ON Semiconductor Malaysia Sdn. Bhd. · Oracle Cloud · 2mo
TECHNICIAN 3, MANUFACTURING
Seremban, Negeri Sembilan, Malaysia- Posted
- 2026-07-17 (2mo)
- Place
- Seremban, Negeri Sembilan, Malaysia
- Commitment
- Full Time
- Education
- Diploma
- Department
- Engineering, Manufacturing
- Source
- Oracle Cloud (the employer’s own listing)
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Skills in this posting
TroubleshootingMechatronicsPreventive Maintenance
Job Summary:
Onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Wire Bonding . The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet Onsemi quality standards . Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements. Accurate data recording, adherence to 5S, safety, and ESD compliance , and strong teamwork are essential.
Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.
Wire Bonder Technician – Job Description
Responsibilities:
-Operate and monitor wire bonder machines to ensure stable production output.
-Perform wire bond processes according to SOP, work instructions, and Onsemi quality standards.
-Machine model involve will be ASM (Extreme family, Gocu, Eagle 60AP, ) & Kns ( Connx Plus)
-Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
-Perform regular machine checks, cleaning, and minor preventive maintenance.
-Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
-Assist in troubleshooting equipment issues and support engineering improvement activities.
-Record production data accurately in system and ensure proper documentation.
-Ensure workplace 5S, safety compliance, and proper ESD handling at all times.
Requirements:
• Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
• Experience in semiconductor die attach/dieClip bonding / wire bonding process is an added advantage.
• Able to work in shift
• Basic troubleshooting and machine-handling skills.
• Good teamwork, discipline, and communication skills.
• Willing to learn and adapt in fast-paced production environment
Also posted at hctz.fa.us2.oraclecloud.com
ON Semiconductor Malaysia Sdn. Bhd.
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