ON Semiconductor Malaysia Sdn. Bhd. · Oracle Cloud · 2mo
TECHNICIAN, MANUFACTURING EQUIPMENT
Negeri Sembilan, Malaysia- Posted
- 2026-07-30 (2mo)
- Place
- Negeri Sembilan, Malaysia
- Commitment
- Full Time
- Education
- Diploma
- Department
- Technician
- Source
- Oracle Cloud (the employer’s own listing)
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Skills in this posting
TroubleshootingMechatronicsPreventive Maintenance
Job Summary: Final test
Candidate with Diploma in Engineering discipline of Electrical/Mechatronic/Electronics with several years of experience in semiconductor testing environment is essential.Knowledge in turret-based handler, multisite discrete and analog testing methodology, automatic vision inspection covers various aspects such as lead, Coplan, marking, packages are Key to this job.
Job Summary: Front End
Seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet onsemi quality standards . Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements. Accurate data recording, adherence to 5S, safety, and ESD compliance , and strong teamwork are essential.
Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.
Key Duties and Responsibilities Final Test
• Carry out routine RCM task to ensure equipment in tip top condition.
• Check and service ownership machine to sustain and meet MTBA performance measurement.
• Attend repair ticket timely with adequate sense of urgency & skill, to ensure uptime is meet.
• Coordinate with shift ME in output focus related, perform troubleshooting, setup, or conversion to deliver on time.
• Isolate, segregate & narrow down genuine & non-genuine vision & test rejects, so that scrap is under control.
• Comply to process OCAP, SOP & buyoff checklist always to ensure quality output.
Key Duties and Responsibilities Front End
-Operate and monitor die bond/clip bonder machines to ensure stable production output.
-Perform die/clip attach processes according to SOP, work instructions, and Onsemi quality standards.
-Machine model involve will be ASM ( AD838, Twin 832P, SD890A, AD832D, ) & Shinkawa / Yamaha ( SPA 500, STC 500 )
-Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
-Perform regular machine checks, cleaning, and minor preventive maintenance.
-Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
-Assist in troubleshooting equipment issues and support engineering improvement activities.
-Record production data accurately in system and ensure proper documentation.
-Ensure workplace 5S, safety compliance, and proper ESD handling at all times.
Requirements:
• Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
• Experience in semiconductor die attach/die bonding / wire bonding/ mold-trim / final test process -turret-based handler, Gravity feed Test handler, multisite discrete and analog is an added advantage.
• Able to work in shift
• Basic troubleshooting and machine-handling skills.
• Good teamwork, discipline, and communication skills.
• Willing to learn and adapt in fast-paced production environment
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.
ON Semiconductor Malaysia Sdn. Bhd.
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