ENGR I, MANUFACTURING EQUIP; MFG

Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development. • Support assembly equipment uptime, OEE and maintenance programs. • Lead equipment qualification and readiness for NPI programs. • Coordinate with Process, Product, Quality and Manufacturing teams. • Develop machine recipes, tooling and process parameters. • Support DOE, process characterization and improvement projects. • Drive yield, cycle time and productivity improvements. • Maintain engineering documentation and compliance requirements. • Bachelor Degree in Engineering. • 3–5 years semiconductor assembly experience. • Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment. • Familiar with SPC, FMEA, 8D and DOE methodologies. • Strong analytical and communication skills.