ENGR I, PROCESS; MFG

The Die Attach Process Engineer is responsible for developing, maintaining, optimizing, and troubleshooting die attach manufacturing processes to ensure product quality, yield improvement, cost effectiveness, and production efficiency. The engineer works closely with Production, Quality, Equipment, Product Engineering, Materials, and Manufacturing teams to support daily operations and continuous improvement initiatives. • Monitor and optimize die attach process performance. • Troubleshoot process issues and drive root cause analysis. • Support new product introduction (NPI), qualification, and process transfer activities. • Conduct DOE, yield improvement, and defect reduction projects. • Work with Production, Quality, Equipment, and Engineering teams to resolve manufacturing issues. • Develop and maintain process documentation, specifications, and control plans. • Support material and equipment evaluations. • Bachelor's Degree in Engineering (Mechanical, Chemical, Materials, Electronics, Manufacturing, or related field). • Fresh graduate or up to 2 years of process engineering experience. • Basic knowledge of semiconductor assembly processes is an advantage. • Familiar with SPC, DOE, root cause analysis, and data analysis tools. • Strong analytical, problem-solving, communication, and teamwork skills. • Proficient in Microsoft Office; Minitab/JMP knowledge is a plus.