ON Semiconductor Malaysia Sdn. Bhd. · Oracle Cloud · 3w
Senior Development Reliability Engineer
Seremban, Negeri Sembilan, Malaysia- Posted
- 2026-09-16 (3w)
- Place
- Seremban, Negeri Sembilan, Malaysia
- Commitment
- Full Time
- Experience
- 5+ YOE
- Education
- Master's
- Department
- Engineering, Quality & Reliability
- Source
- Oracle Cloud (the employer’s own listing)
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Skills in this posting
Data AnalysisStatistical AnalysisChemical EngineeringFMEASix SigmaContinuous ImprovementChange ManagementRisk Assessment
JG11 – Senior Development Reliability Engineer
Job Description
• Manage reliability qualification and risk assessments for new discrete and power module semiconductor devices.
• Define, review, and execute change‑driven reliability qualification plans to support continuous improvement initiatives.
• Provide technical reliability risk assessments for product design and manufacturing changes, quality excursions, and customer‑reported issues.
• Support change management review boards by supplying reliability data, analysis, and technical recommendations for approval decisions.
• Drive structured problem solving for qualification failures.
• Serve as a key reliability interface to support customer audits, reliability reviews, and technical inquiries.
• Collaborate closely with global Manufacturing, Quality, Product Engineering, and Suppliers to ensure robust, compliant, and timely changeimplementation.
Job Requirements
• Bachelor’s degree or Master’s degree in Electronics, Materials Science/Engineering, Physics, Chemical Engineering, or related technicaldisciplines.
• 3–5 years of experience in Reliability Engineering, Process Engineering, Product Qualification, or Reliability Laboratory operations.
• Strong knowledge of environmental stress testing and associated failure mechanisms for discrete and module power semiconductors.
• Hands‑on experience with reliability qualification, data analysis, and industry standards (AEC, JEDEC, MIL).
• Good understanding of wafer fabrication, semiconductor assembly and test flows. Experience with SiC a plus.
• Ability to exercise independent technical judgment for change risk assessments and qualification readiness.
• Strong analytical, structured problem‑solving, and communication skills, with the ability to interface effectively with customers and auditors.
• Experience with 8D methodology, including leading cross‑functional teams through the 8D process; Lean Six Sigma Green/Black Belt is preferred.
• Familiarity with FMEA, statistical analysis, control plans, and related quality tools is an advantage.
• <10% travel may be required.
JG11 – Senior Development Reliability Engineer
Job Description
• Manage reliability qualification and risk assessments for new discrete and power module semiconductor devices.
• Define, review, and execute change‑driven reliability qualification plans to support continuous improvement initiatives.
• Provide technical reliability risk assessments for product design and manufacturing changes, quality excursions, and customer‑reported issues.
• Support change management review boards by supplying reliability data, analysis, and technical recommendations for approval decisions.
• Drive structured problem solving for qualification failures.
• Serve as a key reliability interface to support customer audits, reliability reviews, and technical inquiries.
• Collaborate closely with global Manufacturing, Quality, Product Engineering, and Suppliers to ensure robust, compliant, and timely changeimplementation.
Job Requirements
• Bachelor’s degree or Master’s degree in Electronics, Materials Science/Engineering, Physics, Chemical Engineering, or related technicaldisciplines.
• 3–5 years of experience in Reliability Engineering, Process Engineering, Product Qualification, or Reliability Laboratory operations.
• Strong knowledge of environmental stress testing and associated failure mechanisms for discrete and module power semiconductors.
• Hands‑on experience with reliability qualification, data analysis, and industry standards (AEC, JEDEC, MIL).
• Good understanding of wafer fabrication, semiconductor assembly and test flows. Experience with SiC a plus.
• Ability to exercise independent technical judgment for change risk assessments and qualification readiness.
• Strong analytical, structured problem‑solving, and communication skills, with the ability to interface effectively with customers and auditors.
• Experience with 8D methodology, including leading cross‑functional teams through the 8D process; Lean Six Sigma Green/Black Belt is preferred.
• Familiarity with FMEA, statistical analysis, control plans, and related quality tools is an advantage.
• <10% travel may be required.
ON Semiconductor Malaysia Sdn. Bhd.
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