SOSM QFN Die Bond and Wire Bond Equipment Engineer

The Equipment Engineer, Die Bond & Wire Bond (JG10), is responsible for sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The role focuses on equipment reliability, uptime, preventive and predictive maintenance, equipment qualification, automation, and continuous improvement. The Engineer collaborates with Production, Process Engineering, Quality, Maintenance, and equipment suppliers to ensure stable equipment performance, manufacturing efficiency, and safe operations. • Provide engineering support for Die Bond and Wire Bond equipment to ensure high equipment uptime and manufacturing efficiency. • Lead equipment troubleshooting and root cause analysis for machine-related issues that affect production, yield, or quality. • Develop and implement corrective and preventive actions to improve equipment reliability and prevent recurrence. • Monitor and analyze equipment performance indicators, including OEE, MTBF, MTTR, utilization, and downtime trends. • Lead continuous improvement and cost-reduction projects to improve equipment productivity, availability, and maintenance effectiveness. • Support equipment installation, setup, conversion, qualification, acceptance testing, and release to production. • Develop, optimize, and maintain preventive maintenance and predictive maintenance programs. • Work with equipment suppliers and vendors to resolve technical issues, implement upgrades, and improve machine capability. • Drive automation, digitalization, and Industry 4.0 initiatives to enhance equipment monitoring and manufacturing efficiency. • Support new product introduction, engineering builds, technology transfers, and product qualification activities. • Perform machine capability studies, equipment validation, and qualification activities. • Develop and maintain equipment procedures, maintenance specifications, spare-parts strategies, and operating standards. • Ensure compliance with company safety, environmental, quality, and regulatory requirements. • Support internal, customer, and external audits, including corrective action implementation where required. Education • Bachelor’s Degree in Electrical & Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, Automation Engineering, Industrial Engineering, or an equivalent engineering qualification. Alternatively, candidates holding a Diploma with at least 5 years of relevant industry experience will be considered. Experience • Minimum 2-5 years of experience in semiconductor manufacturing or equipment engineering. • Hands-on experience supporting Die Bond and/or Wire Bond equipment is highly preferred. • Experience in equipment maintenance, troubleshooting, optimization, and reliability improvement within a manufacturing environment. Technical Knowledge • Strong knowledge of Die Bond and Wire Bond equipment operation, maintenance, and troubleshooting. • Understanding of servo systems, motion control, vision systems, sensors, pneumatics, and machine control systems. • Knowledge of preventive maintenance, predictive maintenance, Total Productive Maintenance, and equipment reliability methodologies. • Familiarity with OEE, MTBF, MTTR, FMEA, SPC, and structured root cause analysis. • Experience with equipment qualification, validation, acceptance, and machine capability studies.