Emerson · Oracle Cloud · 1mo
Process Engineer
Bayan Lepas, Penang, Malaysia- Posted
- 2026-08-14 (1mo)
- Place
- Bayan Lepas, Penang, Malaysia
- Commitment
- Full Time
- Experience
- 2+ YOE
- Education
- Bachelor's
- Department
- Process Engineering
- Source
- Oracle Cloud (the employer’s own listing)
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Skills in this posting
Data AnalysisRoot Cause AnalysisManufacturing ProcessesStakeholder ManagementDecision Making
Core Job Responsibilities
• Collaborate cross functionally with Operations, Product Engineering, R&D, Quality, Planning etc to sustain, improve, and optimize manufacturing processes to produce products on time while ensuring quality and cost
• Collaborate across functions with R&D, Product Engineering, Operations, etc to ensure successful and on time new product introduction (NPI) while balancing R&D and manufacturing needs
• Manufacturability of the product (DFM/DFX)
• Responsible for meeting KPIs and lead continuous improvements projects to improve them (OEE, FPY, TPY, DPMO, On-time delivery, cost targets etc)
• New technology research and evaluation on cutting edge manufacturing technology to meet products requirements and improve manufacturing process. Facilitates decision making for setting manufacturing policies and future strategy.
• Design and defines processes that are sustainable and reproducible
• Works independently on complex problems through deep data analysis
• Design and fabricate tools, fixtures and stencils
Education
Minimum B.S. degree in Engineering from an accredited engineering program.
Experience
• 2+ years of experience in a multinational electronics PCBA/SMT process engineering required.
• Experience from a high mix low volume environment, high technology original equipment manufacturer will be preferred.
Skills
• Team player that possesses strong interpersonal and stakeholder management skills, ability to collaborate and gain cross-functional support to meet objectives
• Possess SMT, Wave, manual soldering, press-fit related PCBA manufacturing knowledge, skills, and experience
• Well versed in IPC-A-610, J-std, JEDEC and reverent standards on PCBA
• Experience in practicing Lean, Root cause analysis, Data analysis and Six-sigma DMAIC methodology
• Demonstrates strong problem solving skills, logical and critical thinking in making engineering judgement, exploring and researching new methods or tools
• Works well independently - must be able to perform daily duties with minimum level of supervision
• Excellent communication skills – verbal, written, and presentations
Emerson
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