Senior Manager, Semiconductor IC Packaging & Assembly Engineering

We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This position will focus on yield performance, process stability, quality control, process change management, and manufacturing readiness while working closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM). The ideal candidate combines strong semiconductor packaging assembly expertise with hands-on technical execution, data-driven problem solving, and cross-functional collaboration skills to improve manufacturing performance, product quality, and process robustness across global operations. This role serves as a key technical interface to Package Engineering by helping translate package development intent, qualification requirements, process windows, and ramp readiness into stable, cost-competitive, high-volume manufacturing execution. Key Responsibilities: Manufacturing & Sustaining Engineering Execution • Support sustaining engineering across semiconductor package assembly technologies and product lines. • Execute high-volume manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost. • Develop and maintain engineering practices for process control, defect reduction, and continuous improvement. • Contribute technical input to assembly engineering roadmaps aligned with package technology and business needs. • Work with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls. Yield Monitoring & Continuous Improvement • Monitor assembly yield performance, trends, and corrective action progress. • Execute data-driven yield improvement initiatives using statistical and structured problem-solving methodologies. • Investigate process, reliability, and customer quality issues through disciplined root-cause analysis. • Maintain KPIs and dashboards to track manufacturing performance and engineering effectiveness. Quality & Reliability Management • Partner with Quality and Reliability teams to meet internal, industry, and customer standards. • Support containment, corrective, and preventive actions for manufacturing and field quality issues. • Ensure process controls and qualification requirements are maintained across OSAT sites. • Support customer, supplier, and internal quality audits and reviews. • Work with manufacturing partners to resolve issues early and ensure shipment of qualified products. Process Change Management • Support process change management for materials, equipment, tooling, flows, and sites. • Assess engineering changes for technical, quality, reliability, supply, and operational impact. • Develop and execute qualification plans for transfers, second sourcing, equipment changes, and cost reductions. • Maintain disciplined documentation, change control, and manufacturing readiness processes. NPI to High Volume Manufacturing Ramp • Serve as a manufacturing engineering interface for NPI-to-production transfers. • Drive manufacturability reviews and package-process integration during product development. • Support manufacturing readiness, process optimization, and structured ramp execution for new products. • Ensure process, qualification, material, site, and capacity readiness for high-volume ramp. • Coordinate ramp execution with cross-functional engineering, supply chain, and quality teams. OSAT Partner Management • Coordinate with global OSAT and contract manufacturing partners supporting development and production. • Track partner performance related to yield, quality, cycle time, reliability, and capacity. • Participate in technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners. • Collaborate with suppliers and OSAT partners on transfers, optimization, scaling, and cost improvement. Team Collaboration & Technical Capability Development • Provide technical guidance and day-to-day support to assembly engineering team members. • Promote collaboration, technical discipline, accountability, and continuous improvement within the team. • Help strengthen engineering processes and technical capabilities to support evolving business and technology needs. • Support technical mentoring, knowledge sharing, and capability growth within the engineering organization. • Contribute packaging assembly expertise to support product execution, customer readiness, and manufacturing ramp. Required Qualifications: • Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline. • 15+ years of semiconductor manufacturing and packaging engineering experience with strong exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers. • 3+ years of experience leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing environments. • Strong expertise in semiconductor package assembly and related processes including FET wafer metallization processing, thin die processing, wirebond, clip attach, flip chip, solder die attach, reflow, molding, package singulation, package buffing/grinding, die embedding, and SMT. • Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and st…