ATE Hardware Design - Principal Engineer

We are seeking a highly experienced and driven Principal Engineer to lead the end-to-end design, development, integration, and validation of advanced ATE test hardware. This senior technical role combines deep hands-on expertise with cross-functional influence to deliver robust, high-performance test solutions that enable successful new-product introduction and high-volume manufacturing. Key Responsibilities • Own the complete ATE test hardware development lifecycle, from requirements definition and architecture through design, verification, validation, release, and production support. • Design and review complex test hardware, including load boards, probe cards, sockets, and related interfaces for wafer sort and final test applications. • Lead schematic, stack-up, component-placement, routing, and design reviews, with particular focus on signal integrity, power integrity, manufacturability, reliability, and first-time-right execution. • Perform or guide SI/PI analysis, design simulation, hardware bring-up, debugging, root-cause analysis, and corrective-action implementation. • Partner closely with Business Line Test Engineering, Product Engineering, Operations, Quality, Procurement, and external manufacturing partners to ensure technical alignment, quality, cost, and schedule performance. • Define and improve test hardware design methodologies, guidelines, validation strategies, and reusable best practices across projects and sites. • Coordinate multiple hardware initiatives, manage technical risks and priorities, and support test hardware technology and supplier lifecycle planning. • Provide technical leadership, mentoring, and design guidance to engineers, suppliers, and cross-functional project teams. • Develop and maintain strong technical partnerships with global test hardware suppliers; drive supplier capability, quality, responsiveness, and continuous improvement. Required Technical Expertise • Deep understanding of the full hardware development process: design, verification, validation, release, and production support. • Strong knowledge of semiconductor back-end assembly and test operations, including industrial and high-volume manufacturing environments. • Hands-on experience with major ATE platforms such as Advantest V93000 and EXA Scale, Teradyne J750, UltraFLEX , and UltraFLEXplus , or comparable systems. • Expertise in high-speed digital design and signal integrity, power delivery and power integrity, including PMIC applications, and complex multilayer PCB design. • Advanced knowledge of PCB layout practices, stack-up definition, SI/PI analysis, design-for-manufacturability, and hardware validation. • Strong understanding of semiconductor test flows, ATE architecture, wafer sort, final test, and the interaction between silicon, package, test hardware, and tester resources. • Proficiency with relevant electronic design and simulation tools such as Cadence Allegro, Keysight ADS, Ansys HFSS, or equivalent tools. • Proven ability to troubleshoot complex electrical and hardware issues using structured problem-solving and data-driven analysis. Qualifications • Bachelor’s or Master’s degree in Electrical Engineering , Electronics Engineering, Computer Engineering, or a related technical discipline. • A minimum of 10 years of relevant experience in ATE test hardware design and development within the semiconductor industry. • Proven track record of delivering complex test hardware solutions in a fast-paced new-product-development and manufacturing environment. • Experience coordinating cross-functional projects, managing external suppliers, and balancing technical performance, quality, cost, risk, and schedule. • Effective written and verbal communication skills in English, with the ability to collaborate and influence across global and multicultural teams. • Ability to operate independently, make sound technical decisions with incomplete information, and provide leadership as a recognized subject-matter expert. Preferred Qualifications • Experience across digital, mixed-signal, high-speed, RF, or power-management semiconductor products. • Experience developing technical roadmaps, design automation, reusable design checks, or standardized hardware development methodologies. • Established working relationships with global PCB, probe-card, socket, and test hardware suppliers. More information about NXP in Greater China... #LI-7743