MY62 NXP Malaysia Sdn Bhd · Workday · 1d
Semiconductor Assembler for TBE Manufacturing
Kuala Lumpur, Malaysia- Posted
- 2026-10-07 (1d)
- Place
- Kuala Lumpur, Malaysia
- Commitment
- Full Time
- Source
- Workday (the employer’s own listing)
Your match
Sign in to see how your skills match this job.
Skills in this posting
Manufacturing Processes
Support Test Back End Manufacturing Processes including Pre Bake, Bake, Combine, Scan and Packing tasks. #LI-DNI NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, see the following useful advice and tips. Are you already an NXP employee? Do not apply here. Instead, you must apply via our internal career page. Thank you for your interest in supporting our recruitment efforts. Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.
MY62 NXP Malaysia Sdn Bhd
37 open roles in Malaysia, straight from MY62 NXP Malaysia Sdn Bhd’s own careers page.
- Process TechnicianKuala Lumpur, Malaysia · 1d
- Mold PM TechnicianKuala Lumpur, Malaysia · 1d
- Wire Bond TechnicianKuala Lumpur, Malaysia · 1d
- Semiconductor Assembler for TBE MFGKuala Lumpur, Malaysia · 1d
- SEMICONDUCTOR ASSEMBLER 1Kuala Lumpur, Malaysia · 2d
- IT Internal AuditKuala Lumpur, Malaysia · 1w
- Packaging development engineerKuala Lumpur, Malaysia · 1w
- Senior Tax AccountantKuala Lumpur, Malaysia · 1w
- SEMICONDUCTOR ASSEMBLER-A1Kuala Lumpur, Malaysia · 2w
- Manager, Global Hardware Enablement (ATKL)Kuala Lumpur, Malaysia · 3w
- Package Roadmap Tool Intern – Package InnovationKuala Lumpur, Malaysia · 3w
- Senior AccountantKuala Lumpur, Malaysia · 3w