R&D Singulation/Dicing Process Engineer

About the role Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production. Key responsibilities • Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies • Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP • Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment • Drive process validation, yield stabilization, troubleshooting, and root-cause analysis • Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness • Provide technical support for customer programs, including feasibility evaluation and issue resolution • Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness About you • Bachelor's degree in Engineering (Mechanical/Materials/Electronics) • 3-5 years of hands-on experience in process engineering in semiconductor manufacturing • Fundamental understanding of advanced semiconductor fabrication and integration processes • Proficiency in preparing technical documentation and delivering presentations • Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage