Process Technician (Dicing/Mask Alignment)

Key Responsibilities: • Operate wafer dicing machines to cut wafers into individual dies according to specifications • Perform mask alignment processes using mask aligner equipment for photolithography • Load and unload wafers, masks, and related materials safely and accurately • Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.) • Conduct routine inspection of wafers and dies to ensure quality standards are met • Monitor process performance and report any abnormalities or defects • Perform basic troubleshooting and preventive maintenance on equipment • Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements • Record production data, process parameters, and inspection results accurately • Support engineers in process improvement and yield enhancement activities Requirements: • Diploma / NITEC in Engineering, Semiconductor Technology, or related field • Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred) • Familiar with dicing saw and mask aligner equipment • Ability to read and follow technical work instructions and drawings • Basic understanding of cleanroom protocols and wafer handling • Good attention to detail and quality awareness • Able to work in a cleanroom environment and shift work (if required)