Technology Development Product Engineer

Responsibilities The Product Engineer (PE) / First Article Inspection Engineer (FAI) serves as a key technical interface between Design Engineering, Manufacturing, Process Engineering, Quality, and customer requirements. The role is responsible for driving product bring-up, New Product Introduction (NPI), FAI, manufacturing readiness, yield improvement, failure analysis, and continuous improvement throughout the product lifecycle—from initial product introduction through mass production and end-of-life. The ideal candidate has strong experience in product engineering and semiconductor/electronics manufacturing, with hands-on knowledge of PCB/substrate fabrication, electrical and mechanical performance, manufacturing processes, statistical data analysis, yield improvement, and failure analysis. 1. Product Ownership & Manufacturing Excellence • Lead end-to-end ownership of assigned products throughout the product lifecycle, from design, NPI, and FAI through mass production and end-of-life. • Drive and monitor product performance, manufacturing yield, reliability, quality, and field performance to meet operational and customer requirements. • Ensure products meet defined electrical, mechanical, quality, reliability, and manufacturing requirements throughout the product lifecycle. 2. Yield Engineering & Continuous Improvement • Analyze manufacturing and post-manufacturing test data using statistical analysis and data-mining techniques to identify trends/risk, root causes, and improvement opportunities. • Drive corrective and preventive actions to improve yield, quality, cost, and manufacturing efficiency. • Identify opportunities for continuous improvement. • Establish appropriate sampling and data collection strategies from volume production units to monitor and optimize product and process performance. 3. Manufacturing Readiness & Production Support • Support production ramp-up and soft launch activities, monitoring product and process performance against defined targets. • Support customer and internal technical reviews related to product performance, manufacturing readiness, quality, and reliability. 4. Product Engineering & Process Development • Evaluate PCB and substrate manufacturing processes and their impact on product electrical, mechanical, and reliability performance. • Apply knowledge of key PCB/substrate manufacturing processes, including: • Build-up insulation • Dry Film Resist (DFR) patterning • Plating • Solder resist • Automated Optical Inspection (AOI) • Automated Optical Shaping (AOS) Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals. Qualifications & Requirements • Bachelor’s degree or higher in Electrical and Electronics Engineering, Electrical Engineering, Mechanical Engineering, or a related engineering discipline. • Minimum 4–5 years of relevant experience in product engineering, semiconductor manufacturing, electronics manufacturing, or related industries. • Strong background in product engineering, semiconductor packaging, PCB/substrate manufacturing, and process development. • Hands-on experience with manufacturing processes and product characterization, yield analysis, troubleshooting, and failure analysis. • Experience leading or supporting NPI projects from product verification and qualification through production ramp and high-volume manufacturing is highly desirable. • Strong understanding of mechanical engineering principles and their application to semiconductor packaging and product performance. • Self-motivated, proactive, and able to work independently with minimal supervision. • Strong interpersonal, communication, and cross-functional collaboration skills.