Process Engineer (Wire Bond)

Responsibilities • Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality • Ensure wire bonding process meets customer's specifications and requirements • Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure • Co-ordinate NPI and NPQ activities to meet given timeline • Qualify new product, material, device, and machinery • Participate in new tape development, and new material development activities • Perform supplier sourcing and qualification activities jointly with purchasing and engineering team • Benchmark new materials and new equipment technology in the market • Train co-workers on new process implementation and new machinery operations • Maintain, troubleshoot, and perform minor repair of assembly and test machinery • Develop new and update existing Standard Operating Procedures • Participate in internal audits, customers' audits and external audits • Comply with all quality, environmental, health, safety, and security policies and procedures of the Company Requirements • Degree or Diploma in Material Science / Electronics Engineering • Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT) • Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires • Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates. • Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing • Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives • Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC • Good in problem solving, excellent interpersonal and communication skill GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960