Process & Application Engineer (Die-Bonding / Thermo Compression Bonding / Visual inspection)

Key Responsibilities • Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment. • Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI). • Quality & Inspection: Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment). • Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs. Required Qualifications • Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields. • Experience: 2+ years in semiconductor packaging or microelectronics assembly. • Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems. • Tools: Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).