Technology Development Engineer (Advanced Packaging)

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team. Job Responsibilities: • Work on 2.5D/3D packaging platform technologies. • Develop bump, underfill, molding and RDL processes. • Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration. • New advanced packaging process verification and qualification. • Customer engagement and new product verification Capability • Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus. • Experienced in 2.5D and 3DIC process development are plus. • Skill on FMEA, control plan, DOE (design of experiment) and problemsolving. • Good communication, self-motived and avid learner Qualification • Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields. • At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields. • ProficientEnglish oral and writing skill.