R&D Senior / Engineers

R&D - Lithography R&D - Underfill / Cure R&D - Plating, PR Strip, Wet Etch R&D - CA & TCB Responsibilities: • To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap. • Lead assigned projects. • Yield Improvement & Yield Failure Analysis (FA) • Technology Qualification & Transfer • Equipment & Material Evaluation Requirements: • Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials • R&D or mass production experience of at least three years in processes • Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel) • Strong analytical and problem-solving skills • Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting • Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.