Equipment Senior / Engineer (semiconductor industry)

Equipment - CoW (Chip-on-wafer) Equipment - Bumping Responsibilities: • To manage, operate, and maintain all core process equipment and associated utility interfaces to ensure maximum tool availability and operational stability. • To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for line equipment • Tool Hook-up, Setup & New Equipment Qualification • Equipment OEE Optimization & Spare Parts Management • Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling Requirements: • Bachelor’s degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience) • R&D or mass production experience of at least eight years in semiconductor equipment engineering • Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D • Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification • Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams