Senior Packaging Engineer (Advanced Semiconductor Packaging)

Key Responsibilities · Package Architecture & Design: Define and develop semiconductor package solutions (e.g., Flip-Chip, Wirebond, 2.5D/3D, Chiplets, CoWoS, FOWLP, SiP) from concept to mass production. · Evaluate package architectures, interconnect strategies, substrate stack-ups, and material selections to meet electrical, thermal, mechanical, and reliability requirements. · Design and define substrate stack-ups, routing strategies, and interconnect structures to meet high-speed, high-density, and manufacturability requirements. · Collaborate with SI/PI teams to optimize package-level electrical performance including high-speed IO and power delivery. · Simulation & Multi-Physics Collaboration: Collaborate with thermal and mechanical engineering teams to perform simulations (warpage, stress, CTE mismatch). · New Product Introduction (NPI) &Manufacturing: Lead package development through NPI to high-volume manufacturing (HVM), ensuring DFM, cost, yield, and reliability targets. · Collaborate with OSAT vendors and substrate suppliers to ensure process readiness, qualification, and ramp. · Process Development & Yield Improvement: Develop backend processes (bumping, assembly, molding, underfill). · Materials & Reliability Engineering: Evaluate packaging materials and define BOM. · Ensure reliability through qualification and failure analysis. · Cross-functional Collaboration: Work with IC design, SI/PI, system, and manufacturing teams for chip-package-system co-design. Requirements: · Master’s degree or above in Mechanical Engineering, Electrical Engineering, Materials Science, Microelectronics, or related fields. · 3+ years of experience in semiconductor packaging, preferably in advanced packaging. · Strong understanding of packaging technologies such as Flip-Chip, FOWLP, WLCSP, and 2.5D/3D integration. · Hands-on experience in substrate design (stack-up definition, routing, and manufacturability). · Experience with NPI, OSAT engagement, and high-volume manufacturing. · Knowledge of package materials, assembly processes, and reliability standards.