Wafer Fab Process Engineer

Job Summary Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets. Key Responsibilities • Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation). • Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies. • Drive new process integration (NPI) and process transfer to high-volume manufacturing. • Perform root cause analysis and implement robust corrective/preventive actions. • Define process control plans, SPC strategies, and OCAP execution. • Collaborate cross-functionally with equipment, integration, quality, and R&D teams. • Mentor junior engineers and technicians. • Interface with suppliers on process and material improvements. • Qualifications • Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related). • At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation. • Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools. • Demonstrated leadership in cross-functional technical projects. • Strong analytical, problem-solving, and communication skills • Preferred • PhD in Engineering (Electrical, Chemical, Materials, or related). • Six Sigma certification (Green/Black Belt). • Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.