Associate Engineer – Wire Bond Equipment

About us STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide. About the role We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment. Key responsibilities • Perform machine setup, qualification, and conversion for wire bond equipment. • Troubleshoot and repair equipment-related issues to minimize production downtime. • Conduct preventive and corrective maintenance activities. • Monitor equipment performance and implement improvement actions. • Support production during machine breakdowns and urgent technical issues. • Perform root cause analysis and corrective actions. • Maintain equipment documentation and spare parts records. What we're looking for • Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field. • Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting. • Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred. • Strong troubleshooting and problem-solving skills. • Knowledge of semiconductor backend assembly processes is an advantage. • Able to support 12-hour rotating shifts. • Willing to work both Day Shift and Night Shift based on operational requirements.