Senior Research Engineer I, Adv Pkg, IME

• Process integration development for high density multi-chip fan-out wafer level packaging for various applications such as AI/ HPC, Co-package Optics, Power devices etc. • Drive the development of new capabilities such as fine pitch RDL, micro bumping, multi-layer RDL, polymer damascene etc required for future FOWLP integration. • Establish novel RDL-first and mold-first fan-out packaging integration flows to meet industry partners requirements for various applications. • Plan short loops and work with process module team to develop various processes and materials evaluation for FOWLP. • Work with industry partners and multidisciplinary team members to execute the projects/assigned tasks by resolving issues. • Conduct engineering experiments for process characterization to drive quality and yield improvements. • Coordinate and support engineering build using developed packaging processes and integration. • Lead industry and internal capability development projects with manageable risks and mentor less experienced colleagues. • Inspire and mentor young talent in semiconductor technology, contributing to workforce development in the field. • Publish new findings and technological advancement in prestigious journals and overseas/local conferences. Job Requirements: • Bachelors/Masters in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or Diploma holder with any engineering or science related field. • 5 to 10 years of experience in any semiconductor devices fabrication process integration, and experience in wafer level bumping, RDL and fan-out wafer level package integration will be added advantage. • Hands-on experience in semiconductor manufacturing processes such as lithography, plating, etching as well as RDL and bumping process integration. • Knowledge of wafer level fabrication processes and advanced packaging technologies, methodologies, and reliability characterization is preferable, but not mandatory. • Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments. • Excellent written and verbal communication abilities. • Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously. • Demonstrated expertise in heterogeneous integration, FOWLP technologies, and advanced packaging processes.