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118-WW TMG MFG OPS · Oracle Cloud · 3w

Junior Die Attach/Die Bond Equipment Technician

Kuala Lumpur, Malaysia
2+ YOEDiplomaEntry Level
Posted
2026-09-14 (3w)
Place
Kuala Lumpur, Malaysia
Experience
2+ YOE
Education
Diploma
Department
Manufacturing
Source
Oracle Cloud (the employer’s own listing)

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