Die Prep Equipment Engineer (MES Project)

Change the world. Love your job. Join TI as a specialized Equipment Engineer to drive the digital transformation of our Die Prep lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment. Key Responsibilities: • MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states. • Integration & Data: Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic. • Validation: Validate integration scenarios and support UAT and deployment. • Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation. Minimum Requirements: • Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree • Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum 2 years of relevant experience Preferred Qualifications: • Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome • Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early • Experience on tool monitoring and interdiction software, and equipment maintenance and documentation • Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors. • Strong verbal and written communication skills • Demonstrated strong analytical, critical thinking and problem solving skills • Ability to work in teams and collaborate effectively with people in different functions • Ability to take the initiative and drive for results • Strong time management skills that enable on-time project delivery • Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment • Demonstrated ability to build strong, influential relationship