Wirebond & Die Attach Process Engineer (MES Project)

Change the world. Love your job. Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency. Key Responsibilities: • MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability. • Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition. • Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment. • Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework. Minimum requirements: • Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field • Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience • Strong foundation in statistical process control, engineering change control and process release strategies Preferred qualifications: • • Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early • Experience in optimizing process parameters for wedge bonding or die attach accuracy. • Demonstrated strong analytical and problem solving skills • Strong verbal and written communication skills • Ability to work in teams and collaborate effectively with people in different functions • Strong time management skills that enable on-time project delivery • Demonstrated ability to build strong, influential relationships • Ability to work effectively in a fast-paced and rapidly changing environment • Ability to take the initiative and drive for result