118-WW TMG MFG OPS · Oracle Cloud · 1w
Die Prep Process Engineer (MES Project)
Kuala Lumpur, Malaysia- Posted
- 2026-09-28 (1w)
- Place
- Kuala Lumpur, Malaysia
- Experience
- 2+ YOE
- Education
- Bachelor's
- Department
- Manufacturing
- Source
- Oracle Cloud (the employer’s own listing)
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Skills in this posting
Mechanical EngineeringElectrical EngineeringChemical EngineeringManufacturing Processes
Change the world. Love your job.
Texas Instruments is seeking a Process Engineer to lead the digital design of our Die Prep manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.
Key Responsibilities:
• MES Implementation (Project Phase): Drive Die Prep process design within the MES. Define flows, routing, and material handling.
• Control & Exception Handling: Define digital process controls and exception handling (holds/rework) specific to Die Prep/Dicing operations.
• Alignment & Validation: Validate workflows with quality and manufacturing teams; support UAT and deployment.
• Sustaining (Post-Project Phase): Return to production to utilize MES data for process optimization, yield analysis, and managing Die Prep process stability.
Minimum requirements:
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong hands-on semiconductor process experience in Die Prep, with minimum 2 years of relevant experience
• Strong foundation in statistical process control, engineering change control and process release strategies
Preferred qualifications:
• Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early.
• Equip with backgrind, dicing process, mechanical saw & laser saw process experiences are welcome
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result
118-WW TMG MFG OPS
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