Staff Engineer-Lead frame & Package Design

• Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices • Ensures that the appropriate documents are in place for all new & existing design changes in PDM • Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability • Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively. • Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage • Performs other functions as may be assigned from time to time by superior. Job Specification • Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software • Skills: Excellent Computer skills • Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design