External Package Innovation Engineer

Hiring: External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. 🔹 Role Overview As an EPI engineer , you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production. 🔹 Key Responsibilities ✅ 1. Role Owner (Strategic & Governance) • Own and lead OSAT-wide and cross-OSAT initiatives • Define and deploy standard development templates and success criteria across OSATs • Drive deployment of Best Known Methods (BKM) and lessons learned • Develop and maintain technology roadmap and capability assessment for each OSAT site • Provide Package Innovation (PI) input for: • External site sourcing strategy • Site selection process (jointly with interface manager) • Lead project governance , including: • Overall project summaries • Stoplight reporting • Regular reviews per OSAT site ✅ 2. Supporter (Execution & Project Delivery) • Support NPI & NTI projects executed at external OSAT factories • Ensure OSAT compliance with: • Development processes • Required documentation/templates • Drive alignment on SME (Subject Matter Expert) assignment at OSAT • Support and resolve technical and project issues on-site and across time zones • Ensure assembly readiness and safe production launch 🔹 Stakeholder Collaboration You will work closely with cross-functional teams, including: • Project Leaders & Development Managers • Designers & Materials Engineers • Tech Integration & Modelling teams (Electrical, Mechanical, Thermal) • API and WLP/PLP/FC SMEs • OSAT partners 🔹 What We’re Looking For • Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage. • Proven ability to manage cross-site, cross-functional projects • Solid understanding of NPI/NTI development flows • Excellent stakeholder management and communication skills • Ability to drive standardization, governance, and technical problem-solving 🌟 Why Join Us • Opportunity to lead high-impact package innovation initiatives • Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth • Drive technology roadmap and next-generation packaging solutions More information about NXP in Malaysia... #LI-633a