MY62 NXP Malaysia Sdn Bhd · Workday · 1mo
SEMICONDUCTOR ASSEMBLER I
Kuala Lumpur, Malaysia- Posted
- 2026-08-20 (1mo)
- Place
- Kuala Lumpur, Malaysia
- Commitment
- Full Time
- Education
- SPM / High school
- Source
- Workday (the employer’s own listing)
Your match
Sign in to see how your skills match this job.
Skills in this posting
Continuous ImprovementStandard Operating Procedures
Key Responsibilities
• Operate production machines and equipment according to standard operating procedures (SOPs)
• Follow work instructions, control plans, and visual aids accurately
• Conduct in-process inspections to ensure products meet quality standards
• Record production data, defects, and abnormalities clearly and accurately
• Escalate equipment issues, quality problems, or safety concerns to supervisors promptly
• Maintain good housekeeping and comply with 5S standards
• Comply with safety, ESD, and environmental regulations at all times
• Support line balancing, changeovers, and continuous improvement activities
• Work collaboratively with technicians, engineers, and team members to achieve production goals
• Adhere strictly to quality requirements and defect prevention practices
• Follow all safety rules, PPE requirements, and company policies
• Maintain ESD discipline (where applicable)
• Participate in safety talks, quality briefings, and training sessions
Requirements / Qualifications
• Minimum secondary school education (SPM or equivalent)
• Experience in a manufacturing or production environment is an advantage
• Ability to follow written and visual instructions accurately
• Basic understanding of quality concepts and safety practices
• Willingness to work on shifts (if required)
• Good teamwork, discipline, and attitude
• Physically fit for standing and repetitive tasks
#LI-DNI
Also posted at nxp.wd3.myworkdayjobs.com, nxp.wd3.myworkdayjobs.com
MY62 NXP Malaysia Sdn Bhd
37 open roles in Malaysia, straight from MY62 NXP Malaysia Sdn Bhd’s own careers page.
- Process TechnicianKuala Lumpur, Malaysia · 1d
- Mold PM TechnicianKuala Lumpur, Malaysia · 1d
- Wire Bond TechnicianKuala Lumpur, Malaysia · 1d
- Semiconductor Assembler for TBE ManufacturingKuala Lumpur, Malaysia · 1d
- Semiconductor Assembler for TBE MFGKuala Lumpur, Malaysia · 1d
- SEMICONDUCTOR ASSEMBLER 1Kuala Lumpur, Malaysia · 2d
- IT Internal AuditKuala Lumpur, Malaysia · 1w
- Packaging development engineerKuala Lumpur, Malaysia · 1w
- Senior Tax AccountantKuala Lumpur, Malaysia · 1w
- SEMICONDUCTOR ASSEMBLER-A1Kuala Lumpur, Malaysia · 2w
- Manager, Global Hardware Enablement (ATKL)Kuala Lumpur, Malaysia · 3w
- Package Roadmap Tool Intern – Package InnovationKuala Lumpur, Malaysia · 3w