Senior Engineer - Process Development - CVD/Diffusion

Job / Role Summary The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities • Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. • Design and execute experiments, analyze data, and communicate results in appropriate technical forums. • Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes. • Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership. • Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements. Other Responsibilities • Maintain accurate documentation of experiments, process settings, and learnings; produce technical reports and summaries. • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Candidate Profile Minimum Required Qualifications / Experience • PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field • Demonstrated foundation in thin film deposition and characterization; R&D/PD environment readiness is important for this role. Must-Have Technical Skills • Fundamentals of thin film deposition (CVD/Diffusion) and film characterization. • DOE/SPC basics; ability to analyze experimental data and draw conclusions. • Understanding of plasma/vacuum systems and process-chemistry relationships (where applicable). Must-Have Soft Skills • Structured problem-solving and learning agility in an R&D environment. • Clear communication and cross-functional collaboration. Highly Desirable / Preferred • Exposure to dielectric / carbon-based films and NAND structural/electrical requirements. • Experience working with equipment suppliers or tool qualification/transfer activities. Embody Micron’s core values: • People – Respect, develop and empower others • Innovation – Drive continuous improvement and breakthrough thinking • Tenacity – Show grit and determination • Collaboration – Build trust and foster teamwork • Customer Focus – Deliver excellence and value