Principal Engineer – Process Development, Cell Film, NAND

Role Summary The Principal Engineer provides technical leadership for Cell Film process development, defining technical direction, fostering innovation, and ensuring successful integration of new processes into manufacturing to enable next-generation NAND device scaling. Defines and implements technical strategy; leads cross-functional teams; owns end-to-end module development with manufacturability/scalability readiness. Resolves complex technical challenges with business impact and drives transfer and ramp readiness into high-volume manufacturing. Main Responsibilities Strategy, Roadmap & Technical Direction • Define and implement technical strategy for cell film process development aligned to business and technology objectives. • Identify emerging trends/risks/opportunities and recommend future investments/initiatives. End-to-End Module Development & Scaling • Lead multi-functional development, integration, and scaling of thin film processes tailored for advanced NAND devices; ensure manufacturability/scalability/readiness for integration. • Drive technology transfer and ramp-up activities to ensure seamless transition from R&D to high-volume manufacturing. Complex Problem Solving & Business Outcomes • Resolve complex technical challenges (including RCA/mitigation of process/device failures). • Lead cost reduction, yield improvement, and reliability enhancement programs via innovative process/material utilization. Leadership & External Representation • Mentor senior engineers and influence technical direction across the organization; represent the function in technical forums and strategic collaborations (consortia, conferences, joint development). Other Responsibilities • Mentor senior engineers and influence technical direction across the organization. • Represent the function in technical forums and strategic collaborations; benchmark against industry standards. • Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives. • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Candidate Profile Minimum Qualifications / Experience • PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, • With experience in thin film R&D for microelectronic devise, with a proven track record of leading complex technology development Must-Have Technical Skills • Deep hands-on expertise in ALD/CVD thin film processes for 3D NAND cell applications, including process development, optimization, and sustainment in manufacturing. • Strong understanding of process–device interactions , scaling challenges, and reliability behavior, with the ability to diagnose film-related performance and yield issues. • Proven ability to drive materials, chemistry, and process improvements (including tool-related optimizations) through structured experimentation and cross-functional collaboration. • Proficient in DOE, SPC, and data analytics to optimize processes and resolve complex issues, while serving as a technical lead/mentor across process, integration, and manufacturing teams. Must-Have Soft Skills • Structured problem-solving and learning agility in an R&D environment. • Clear communication and cross-functional collaboration. Highly Preferred • Contributes to technology benchmarking, roadmap inputs, and clear technical documentation or IP generation. Embody Micron’s core values: • People – Respect, develop and empower others • Innovation – Drive continuous improvement and breakthrough thinking • Tenacity – Show grit and determination • Collaboration – Build trust and foster teamwork • Customer Focus – Deliver excellence and value