5 days Application Engineer up to $6000 (Woodlands)

Application Engineer $4,000 – $6,000 9am – 6pm (Mon to Fri) Woodlands Job Responsibilities • Develop, optimize and qualify die bonding processes and equipment. • Set up, calibrate and troubleshoot machines; adjust process parameters and recipes. • Conduct root cause analysis and implement corrective actions for equipment/process issues. • Support process improvement, yield enhancement and cycle-time optimization. • Collaborate with R&D, Engineering, Manufacturing and Quality teams on technical issues. • Provide installation, application and technical support at customer sites. • Conduct customer training and support Field Application Engineers. • Gather customer feedback and support product/process improvement. Requirements • Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering disciplines. • Minimum 2 years of relevant experience in semiconductor equipment, automation, advanced packaging or precision manufacturing. • Experience in die bonding/die attach, flip-chip, wire bonding, SMT, wafer handling, semiconductor automation or precision robotics. • Hands-on experience in machine setup, calibration, troubleshooting and parameter adjustment. • Knowledge of precision motion systems, servo systems, sensors, vacuum, pneumatics and tooling. • Experience with vision/alignment or precision positioning systems is an advantage. • Familiar with process engineering and data analysis, including DOE, SPC, Cp/Cpk, GR&R or process qualification. • Knowledge of RCA and problem-solving tools such as 5-Why, Fishbone, 8D, DOE or FMEA. • Willing to travel to customer sites when required. Company Name: Talent Recruitment Pte Ltd EA License No: 24C2338 EA Personnel Name: Loke Sai Lye (Loke) EA Personnel No: R24123366 Email: sales@talentrecruitmentsg.com Contact Number: 81688648