Advanced Packaging & Process Integration Engineer – Leading R&D Organization

Our client is a well-established research and technology organisation , focusing on advanced R&D and the development of next-generation semiconductor technologies. We are looking for an Advanced Packaging & Process Integration Engineer to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies. Position: Advanced Packaging & Process Integration Engineer Employment Type: Full Time, Permanent Location: Singapore Responsibilities: • Research and develop fine-pitch flip-chip and hybrid bonding technologies • Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes • Support interposer and hybrid bond pad fabrication and process integration • Optimise bonding materials, surface preparation and process parameters • Conduct engineering experiments, process optimisation and data analysis • Improve process yield, performance and reliability • Support 2.5D / 3D heterogeneous integration technology development • Collaborate with internal teams and external partners on R&D projects Requirements: • Bachelor’s Degree in Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering or related discipline • 1–6 years of relevant experience in microelectronics, semiconductor or component integration • Experience in advanced packaging / process integration is preferred • Hands-on experience in flip-chip bonding will be advantageous • Knowledge of hybrid bonding equipment and materials is advantageous • Experience in process development, data analysis and DOE preferred • Good analytical, problem-solving and communication skills **Interested candidates, kindly email updated resume to sandra@wanco-manpower.com with Subject of "Advanced Packaging & Process Integration Engineer", thank you.