Manpower Staffing Services (Singapore) Pte Ltd · MyCareersFuture · 1w
Product Specialist - Flip Chip/Wire Bond
Singapore- Posted
- 2026-09-25 (1w)
- Place
- Singapore
- Commitment
- Full Time
- Salary
- SGD 5,000 – 8,000 / month
- Experience
- 5+ YOE
- Department
- Information Technology
- Source
- MyCareersFuture (the employer’s own listing)
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Skills in this posting
Customer FocusWire BondingSemiconductor ProcessTroubleshootingTechnical Support
Process-Oriented Product Specialist who understands semiconductor packaging and bonding processes
Key skills:
• Thermal Compression Bonding (TCB)
• Die Attach / Die Bonding
• Wire Bonding
• Flip Chip
• Advanced Packaging (SiP, WLCSP, BGA, QFN)
• Semiconductor Process Engineering
The role involves providing technical support to customers, troubleshooting process-related issues, collaborating with engineering teams, and supporting semiconductor assembly and packaging solutions across region.
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