IC Packaging Engineer – Semiconductor

About the Role We are seeking a dedicated IC Packaging Engineer to join our semiconductor engineering team. This role involves developing and optimizing integrated circuit (IC) packaging solutions , ensuring performance, reliability, and manufacturability for advanced semiconductor products. Fresh graduates with strong academic foundations in microelectronics or materials engineering are welcome to apply. Key Responsibilities • Design and develop IC packaging solutions (wire bonding, flip-chip, WLP, BGA, CSP, etc.). • Collaborate with design, process, and test engineering teams to ensure package reliability and yield. • Perform thermal, mechanical, and electrical analysis of packaging designs. • Support DFM (Design for Manufacturability) and ensure compliance with industry standards. • Conduct failure analysis and propose improvements to packaging processes. • Prepare technical documentation and participate in design reviews. Requirements • Bachelor’s Degree in Electrical/Electronic Engineering, Materials Science, or related discipline. • Knowledge of semiconductor packaging technologies and materials. • Familiarity with EDA tools for packaging design and simulation is preferred. • Strong analytical and problem-solving skills. Added Advantage • Experience in advanced packaging technologies (e.g., 2.5D/3D IC, TSV, fan-out wafer-level packaging). • Exposure to semiconductor manufacturing processes and reliability testing. What We Offer • Opportunity to work on cutting-edge semiconductor packaging projects. • Mentorship and training for fresh graduates to build a strong career foundation. • Competitive salary package and career development opportunities. EA Reg No. R1439255 License No. 22C1076